HIGH-DENSITY, HIGH-SPEED MEZZANINE CONNECTORS FOR PARALLEL BOARD INTEGRATION - EXPRO+

Objective: To develop high-density, high-data-rate mezzanine connectors for parallel board integration, ensuring reliable high-speed signal transmission and optimized space efficiency.Description: The increasing modularity of onboard digital processing units, such as those based on the Advanced Data Handling Architecture (ADHA), is driving demand for mezzanine-based designs that allow for mission-specific customisation of front-panel interfaces (e.g., SpW, SpFi, Ethernet, RF ADC/DAC, and memory). These mezzanine boards avoid redesigning complex main PCBs built around high-performance FPGAs and processors, enabling faster iteration and mission tailoring. However, the lack of space-qualified mezzanine connectors that meet mechanical, electrical, and environmental requirements presents a major integration barrier. In the absence of suitable solutions, some suppliers resort to adapting backplane connectors, whichare not optimised for mezzanine use and create challenges in mechanical layout and signal integrity. Commercial mezzanine connectors(COTS) similarly fall short of the standards needed for thermal, outgassing, and reliability performance in space. This activity supports the European strategic goal to develop modular platform architectures for Low Earth Orbit (LEO) satellites, particularly in the mid-size class (100-500 kg, 200 W to 2 kW), by 2028. A new mezzanine connector is aimed to be developed to enable high-speed, high-density signal routing with robust mechanical integration and compliance with space environmental constraints. The design targetsto meet the following key requirements: - Support SerDes (Serialiser/Deserialise) data rates =10 Gbit/s per lane (target: 16.3 Gbit/s; scalable to 30-40 Gbit/s for next-gen FPGAs); - Total pin count around 150-200, with subsets for SerDes, Low-Voltage Differential Signaling (LVDS) (hundreds of Mbit/s), etc.; - Mechanical compatibility with 6HP-height 3U ADHA modules for front-panel interfacing.This activity encompasses the following tasks: - Literature review and market survey of mezzanine/backplane connector technologies,including COTS and qualification status; - Technology and process review to identify promising connector concepts and materials, based on supplier constraints; - Design and prototyping of a new connector optimised for space use in 3U systems; - Electrical characterisation up to 40 Gbit/s/lane and environmental qualification (vibration, thermal cycling, endurance with continuity monitoring);- Identification of limitations, proposed improvements, and roadmap toward space qualification, including a standardisation strategy.Procurement Policy: C(1) = Activity restricted to non-prime contractors (incl. SMEs). For additional information please go to:http://www.esa.int/About_Us/Business_with_ESA/Small_and_Medium_Sized_Enterprises/Opportunities_for_SMEs/Procurement_policy_on_fair_access_for_SMEs_-_the_C1-C4_Clauses